Probe head assemblies, components thereof, test systems including the same, and methods of operating the same

ABSTRACT

Probe head assemblies, components of probe head assemblies, test systems including the probe head assemblies and/or components thereof, and methods of operating the same. The probe head assemblies are configured to convey a plurality of test signals to and/or from a device under test and include a space transformer, a contacting assembly, and a riser that spatially separates the space transformer from the contacting assembly and conveys the plurality of test signals between the space transformer and the contacting assembly. The contacting assembly may include a frame that defines an aperture and has a coefficient of thermal expansion that is within a threshold difference of that of the device under test, a flexible dielectric body that is attached to the frame, maintained in tension by the frame, and extends across the aperture, and a plurality of conductive probes. The plurality of conductive probes may include a dual-faceted probe tip.

RELATED APPLICATIONS

This application is a divisional of and claims priority to U.S. patentapplication Ser. No. 13/463,712, which was filed May 3, 2012, and whichclaims priority to U.S. Provisional Patent Application No. 61/484,116,which was filed on May 9, 2011, and the complete disclosures of whichare hereby incorporated by reference.

FIELD OF THE DISCLOSURE

The present disclosure is directed to probe head assemblies andcomponents thereof that may be utilized to test a device under test, aswell as to methods of operating the same.

BACKGROUND OF THE DISCLOSURE

The trend in electronic device production, particularly in integratedcircuit technology, has been toward fabricating increasingly largernumbers of discrete circuit elements with higher operating frequenciesand smaller circuit element geometries on a single device substrate.After these devices are fabricated, they may be subject to various teststo verify functionality, quantify operating characteristics, and/orcharacterize the manufacturing process. Additionally or alternatively,the devices may be packaged for communication with other devices and/orelectronic components.

Traditionally, these electrical tests have been performed by forming aplurality of electrical contacts with a device under test (DUT),providing electric current to the DUT in the form of input, or test,signals, and receiving electric current or other outputs from the DUT inthe form of output, or resultant, signals. The response of the DUT tovarious input signals and/or power levels may then be quantified throughanalysis of the input and/or output signals.

However, as a density of the individual circuit elements increases, adensity and/or number of bond and/or contact pads, which may becontacted to perform the electrical testing, also may increase. Also, apitch and/or spacing between adjacent pads may decrease and/or a size ofthe individual pads may decrease.

This evolution of integrated circuit technology presents uniquechallenges to the manufacturers of test systems that may be utilized toperform electrical tests. For example, the overall force that is appliedto the DUT by the test system may need to be controlled to be below athreshold level despite significant increases in the number ofelectrical connections that may be made between the test system and theDUT. As another example, a vertical compliance of a probe head assemblythat may be utilized to form the electrical connections with the DUT mayneed to be increased to maintain reliable electrical connection betweenthe probe head assembly and the DUT despite the limitations in theoverall force that is applied to the DUT. As yet another example, thenature of the physical interactions between the probe head assembly andthe DUT may need to be controlled to provide for reliable electricalconnections therebetween. Thus, there exists a need for improved probehead assemblies, probe head assembly components, and methods ofoperation thereof.

SUMMARY OF THE DISCLOSURE

Probe head assemblies, components of probe head assemblies, test systemsincluding the probe head assemblies and/or components thereof, andmethods of operating the same. The probe head assemblies are configuredto convey a plurality of test signals to and/or from a device undertest. The probe head assemblies include a space transformer, acontacting assembly, and a riser that spatially separates the spacetransformer from the contacting assembly and conveys the plurality oftest signals between the space transformer and the contacting assembly.The contacting assembly may include a frame, a flexible dielectric body,and a plurality of conductive probes. The frame defines an aperture andhas a coefficient of thermal expansion that is within a thresholddifference, or threshold valve, of the coefficient of thermal expansionof the device under test. The flexible dielectric body is attached tothe frame, maintained in tension by the frame, and extends across theaperture of the frame. The plurality of conductive probes may include atleast one dual-faceted probe tip.

The space transformer may be configured to transform a spacing betweenthe plurality of test signals as the plurality of test signals traveltherethrough. The contacting assembly may be configured to form aplurality of test contacts with the device under test and to provide atleast a first portion of the plurality of test signals thereto and/orreceive a second portion of the plurality of test signals therefrom.

In some embodiments, the riser includes a substantially rigid riser. Insome embodiments, the riser includes resilient riser. In someembodiments, the riser includes a composite riser assembly. In someembodiments, the riser, space transformer, and/or contacting assemblymay include one or more surface-mounted electronic components. In someembodiments, the riser is configured to define an air gap between theone or more surface-mounted electronic components and the spacetransformer, riser, and/or contacting assembly. In some embodiments, oneor more external test leads may convey one or more of the plurality oftest signals between the control system and the device under testwithout the one or more control signals passing through the spacetransformer and/or the riser.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a schematic cross-sectional view of illustrative,non-exclusive examples of portions of a test system that may utilize theprobe head assemblies, components thereof, and methods according to thepresent disclosure.

FIG. 2 is a schematic cross-sectional view of illustrative,non-exclusive examples of a portion of a probe head assembly thatincludes a riser according to the present disclosure.

FIG. 3 is another schematic cross-sectional view of illustrative,non-exclusive examples of a portion of a probe head assembly thatincludes a riser according to the present disclosure.

FIG. 4 is a schematic cross-sectional view of illustrative,non-exclusive examples of a composite riser assembly according to thepresent disclosure.

FIG. 5 is another schematic cross-sectional view of illustrative,non-exclusive examples of a composite riser assembly according to thepresent disclosure.

FIG. 6 is a schematic cross-sectional view of illustrative,non-exclusive examples of a portion of a probe head assembly thatincludes a composite riser according to the present disclosure.

FIG. 7 is a schematic cross-sectional view of illustrative,non-exclusive examples of a test system that may utilize an externaltest signal lead according to the present disclosure.

FIG. 8 is a schematic representation of an illustrative, non-exclusiveexample of a contacting assembly according to the present disclosure.

FIG. 9 is a schematic cross-sectional view of a first view ofillustrative, non-exclusive examples of a contacting assembly thatincludes a dual-faceted conductive probe according to the presentdisclosure.

FIG. 10 is a schematic cross-sectional view of a second view of thecontacting assembly of FIG. 8.

FIG. 11 is a schematic cross-sectional view of illustrative,non-exclusive examples of a contacting assembly that includes anotherdual-faceted conductive probe according to the present disclosure.

FIG. 12 is a schematic cross-sectional view of illustrative,non-exclusive examples of a contacting assembly that includes anotherdual-faceted conductive probe according to the present disclosure.

DETAILED DESCRIPTION AND BEST MODE OF THE DISCLOSURE

FIG. 1 is a schematic cross-sectional view of illustrative,non-exclusive examples of a test system 20 that may utilize and/orinclude the probe head assemblies, components thereof, and methodsaccording to the present disclosure. Test system 20 includes a probehead assembly 100 that may include a plurality of components that areconfigured to form a plurality of test contacts between the probe headassembly and a device under test (DUT) 60 and to convey a plurality oftest signals 36 between the DUT and a control system 30. The test systemalso may include and/or be utilized in combination with a chuck 50 thatis configured to support DUT 60 and/or locate DUT 60 with respect toprobe head assembly 100, and control system 30 may provide a chuckcontrol signal 52 to chuck 50 to control the operation of the chuck.

Probe head assembly 100 includes a contacting assembly 200 that isconfigured to convey the plurality of test signals 36 between DUT 60 anda riser 170. Riser 170, which additionally or alternatively may be,include, and/or be referred to herein as a fine pitch interposer 170, isconfigured to convey the plurality of test signals between contactingassembly 200 and a space transformer 150.

As shown in dashed lines in FIG. 1, probe head assembly 100 optionallymay include and/or be utilized with a plurality of additionalcomponents, including a space transformer riser 140, which additionallyor alternatively may be, include, and/or be referred to herein as a widepitch riser 140, a wide pitch interposer 130, and/or a printed circuitboard 120 that are configured to distribute the plurality of testsignals therein and/or convey the plurality of test signalstherethrough. An optional stiffener 110 may provide mechanical supportto probe head assembly 100, such as to provide for maintaining a desiredlevel of planarity of the probe head assembly. A probe head frame 142,which may be operatively attached to space transformer riser 140, maylocate a first portion of the plurality of additional components, suchas space transformer riser 140, space transformer 150, riser 170, and/orcontacting assembly 200 with respect to a second portion of theplurality of additional components, such as stiffener 110, printedcircuit board 120, and/or wide pitch interposer 130. Similarly, frame240, which also may be referred to herein as contacting assembly frame240, may locate the contacting assembly with respect to a remainder ofthe probe head assembly and may be operatively attached to probe headframe 142.

Contacting assembly 200 may include any suitable structure that isconfigured to form the plurality of test contacts with DUT 60 and toconvey the plurality of test signals 36 between DUT 60 and riser 170. Asan illustrative, non-exclusive example, the contacting assembly mayinclude a flexible dielectric body 204 that includes a first bodysurface 206 and an opposed second body surface 208. The contactingassembly also may include a plurality of conductive probes 250 that isconfigured to form the plurality of test contacts with the DUT and toconvey the plurality of test signals between first body surface 206,which is proximal to DUT 60, and second body surface 208, which isproximal to riser 170.

As another illustrative, non-exclusive example, contacting assembly 200may include and/or be a membrane probe assembly 202. Illustrative,non-exclusive examples of membrane probe assemblies 202 are disclosed inU.S. Pat. Nos. 7,178,711, 7,368,927, 7,550,983, and 7,893,704, thecomplete disclosures of which are hereby incorporated by reference.Additional illustrative, non-exclusive examples of contacting assemblies200 according to the present disclosure, and/or components thereof, arediscussed in more detail herein.

Contacting assembly 200 may be maintained in electrical and/ormechanical communication with riser 170 by any suitable mechanism and/orin any suitable manner. As an illustrative, non-exclusive example, thecontacting assembly may be adhered to the riser. As anotherillustrative, non-exclusive example, the contacting assembly 200 may beoperatively attached to and/or include frame 240, which may locate orotherwise support and/or position the contacting assembly within probehead assembly 100, and which is discussed in more detail herein withreference to FIG. 7. It is within the scope of the present disclosurethat frame 240 may be configured to tension flexible dielectric body 204of contacting assembly 200 across a first riser surface 176 of riser 170to maintain the flexible dielectric body in a stretched state when theframe is mounted within the probe head assembly.

The tension of flexible dielectric body 204 may generate a restoringforce that may maintain contacting assembly 200, such as flexibledielectric body 204 and/or conductive probes 250 thereof, in contactwith first riser surface 176 and provide for transfer of the pluralityof test signals therebetween. It is within the scope of the presentdisclosure that, while maintained in contact with riser 170 by therestoring force, contacting assembly 200 may not be operatively attachedto the riser and/or may be configured to be removed from the probe headassembly and/or separated from the riser, such as for repair and/orreplacement thereof.

As shown in FIG. 1, frame 240 may be configured to mount to probe headassembly 100 from a side, or region, of the probe head assembly thatfaces device under test 60 during testing of the device under test. Thismay provide for the removal of contacting assembly 200 from probe headassembly 100 without disassembly of, or at least without substantialdisassembly of, a remainder of the components of the probe headassembly.

Riser 170 may serve a variety of purposes within probe head assembly100. As an illustrative, non-exclusive example, and as discussed in moredetail herein with reference to FIG. 2, riser 170 may provide a space,clearance, and/or air gap between space transformer 150 and contactingassembly 200 that may provide clearance for one or more surface-mountedelectronic components 144 that may be present on space transformer 150,riser 170, and/or contacting assembly 200. As another illustrative,non-exclusive example, riser 170 may be configured to locate second bodysurface 208 of flexible dielectric body 204 and/or contacting surfacesof conductive probes 250 at a target location and/or within a targetplane with respect to a location and/or plane of another potion of probehead assembly 100. This may include locating second body surface 208and/or contacting surfaces 252 below a remainder of probe head assembly100 to prevent contact, or undesired contact, between the DUT and theremainder of the probe head assembly. As yet another illustrative,non-exclusive example, riser 170 may be configured to maintain a desireddegree of deformation and/or tension of contacting assembly 200 and/orflexible dielectric body 204 thereof when the contacting assembly ismounted within the probe head assembly.

Referring back to FIG. 1, riser 170 may include any suitable structurethat is configured to spatially separate space transformer 150 fromcontacting assembly 200 and/or convey the plurality of test signalsbetween the space transformer and the contacting assembly. As anillustrative, non-exclusive example, riser 170 may include and/or be aplanar, or at least substantially planar, riser, or riser body 177, thatincludes first riser surface 176 and an opposed, or at leastsubstantially opposed, second riser surface 180. A distance betweenfirst riser surface 176 and second riser surface 180 may define a riserthickness 172. Illustrative, non-exclusive examples of riser thicknessaccording to the present disclosure include riser thicknesses of atleast 0.025 mm, at least 0.5 mm, at least 0.75 mm, at least 0.1 mm, atleast 0.2 mm, at least 0.3 mm, at least 0.4 mm, at least 0.5 mm, atleast 0.6 mm, at least 0.7 mm, at least 0.8 mm, at least 0.9 mm, or atleast 1 mm and/or riser thicknesses of less than 3 mm, less than 2.75mm, less than 2.5 mm, less than 2.25 mm, less than 2 mm, less than 1.75mm, less than 1.5 mm, less than 1.25 mm, less than 1 mm, less than 0.9mm, less than 0.8 mm, less than 0.7 mm, less than 0.6 mm, or less than0.5 mm.

As another illustrative, non-exclusive example, riser 170 may include aplurality of test signal conduits 174 that are configured to convey theplurality of test signals between the contacting assembly, or theplurality of conductive probes thereof, and the space transformer. It iswithin the scope of the present disclosure that the plurality of testsignal conduits may include any suitable structure. As illustrative,non-exclusive examples, the plurality of test signal conduits mayinclude and/or be a plurality of metallic conduits, a plurality ofelectrical conduits, a plurality of electrically conductive conduits, aplurality of optical conduits, a plurality of optically conductiveconduits, a plurality of waveguides, and/or a plurality ofelectromagnetic radiation conductive conduits.

Riser 170 and/or riser body 177 thereof may include any suitablematerial properties and/or materials of construction. As anillustrative, non-exclusive example, riser body 177 may include and/orbe a rigid, or at least substantially rigid, dielectric riser body. Asanother illustrative, non-exclusive example, riser body 177 may includeand/or be a resilient dielectric riser body, an illustrative,non-exclusive example of which is or includes silicone.

Space transformer 150 may include any suitable structure that isconfigured to receive the plurality of test signals and to transform thespacing of the plurality of test signals from a first pitch, or averagespacing, on a first surface of the space transformer to a second(different) pitch, or average spacing, on a second surface of the spacetransformer that is generally opposed to the first surface of the spacetransformer. As an illustrative, non-exclusive example, spacetransformer 150 may include a substantially planar space transformerthat includes a space transformer body that defines the first surface ofthe space transformer and the second surface of the space transformer.As another illustrative, non-exclusive example, space transformer 150may include, be operatively attached to, and/or be in electricalcommunication with a rigid fine pitch riser 159 that is configured toincrease a thickness of space transformer 150. Additional illustrative,non-exclusive examples of space transformers 150 according to thepresent disclosure are discussed in more detail herein with reference toFIGS. 2-3.

Riser 170 may be fabricated separately from and placed intocommunication with space transformer 150. As an illustrative,non-exclusive example, the riser may be operatively attached to thespace transformer, such as by adhesion and/or soldering. As anotherillustrative, non-exclusive example, the riser may be maintained incontact with the space transformer by one or more compressive forces.Alternatively, riser 170 may be fabricated with, fabricated on a surfaceof, and/or integral to space transformer 150.

Control system 30 may include any suitable structure that is configuredto provide test signals 36 to, and/or receive test signals 36 from, DUT60. As an illustrative, non-exclusive example, the control system mayinclude, be in electrical communication with, and/or be a signalgenerator 32 that is configured to generate an input signal that isprovided to the device under test and forms a portion of the pluralityof test signals 36. As another illustrative, non-exclusive example, thecontrol system may include, be in electrical communication with, and/orbe a signal analyzer 34 that is configured to receive in output signalthat is generated by the device under test and forms a portion of theplurality of test signals.

Test signals 36 may include any suitable signal that may be supplied toand/or received from DUT 60. It is within the scope of the presentdisclosure that the plurality of test signals may include a plurality ofdiscrete test signals. Additionally or alternatively, it is also withinthe scope of the present disclosure that at least a first test signal ofthe plurality of test signals may be related to and/or interact with atleast a second test signal of the plurality of test signals.

Illustrative, non-exclusive examples of test signals 36 according to thepresent disclosure include any suitable electrical signal, opticalsignal, electromagnetic signal, electromagnetic radiation, electricfield, and/or magnetic field. Thus, and as used herein, the term“contact” may refer to any suitable type of contact, illustrative,non-exclusive examples of which include mechanical contact, conductivecontact, electrically conductive contact, electromagnetically conductivecontact, magnetically conductive contact, electric field conductivecontact, and/or optically conductive contact. Similarly, and as usedherein, the term “communication” may refer to any suitable type ofcommunication, illustrative, non-exclusive examples of which includemechanical communication, conductive communication, electricallyconductive communication, and/or optically conductive communication. Itis within the scope of the present disclosure that the term “contact”may refer to direct and/or indirect physical contact between thecomponents that are in communication. However, it is also within thescope of the present disclosure that the term “contact” may refer to anysuitable communicative contact that does not necessarily include and/orrely upon direct and/or indirect physical contact between the componentsthat are in communication. Illustrative, non-exclusive examples of suchcontact include reactively coupled communication and/or contact,inductive communication and/or contact, capacitive communication and/orcontact, electromagnetic communication and/or contact, magneticcommunication and/or contact, and/or optical communication and/orcontact.

Device under test 60 may include any suitable structure that isconfigured to be tested by test system 20 and to receive and/or generatetest signals 36. Illustrative, non-exclusive examples of devices undertest (DUTs) 60 according to the present disclosure include any suitableelectronic device, optical device, and/or optoelectronic device. Asshown in FIG. 1, DUTs 60 may be present, formed, and/or fabricated on asubstrate 62 that includes a plurality of DUTs. Illustrative,non-exclusive examples of substrates for DUTs 60 that may be utilizedwith the systems and methods according to the present disclosure includeany suitable semiconductor wafer, silicon wafer, gallium arsenide wafer,and/or other III-V semiconductor wafers that include elements from GroupIII of the periodic table as well as elements from Group V of theperiodic table, and/or wafers coated with one or more layers of one ormore of these substances.

It is within the scope of the present disclosure that test system 20 maybe configured to test at least a portion of the plurality of DUTs thatmay be present on substrate 62 prior to singulation, or separation, ofthe plurality of DUTs from the substrate. Alternatively, it is alsowithin the scope of the present disclosure that test system 20 may beconfigured to test individual DUTs and/or groups of DUTs aftersingulation from the substrate.

As indicated in FIG. 1 at 146, probe head assembly 100 also may includeand/or be in mechanical communication with one or more flexures 146 thatare configured to limit a contact force that is applied to DUT 60 byprobe head assembly 100 and/or contacting assembly 200 thereof duringtesting of the DUT. It is within the scope of the present disclosurethat flexure 146 may be present at any suitable location and/or form aportion of any suitable component of the probe head assembly. As anillustrative, non-exclusive example, the flexure may be located on aside of the space transformer that is opposed to the contactingassembly. As another illustrative, non-exclusive example, flexure 146may be located between printed circuit board 120 and space transformer150. Illustrative, non-exclusive examples of flexures that may beutilized with the systems and methods according to the presentdisclosure include a resilient material, a resilient dielectric materialwith included conductive conduits, and/or a buckling beam.

FIGS. 2-3 are schematic cross-sectional views of illustrative,non-exclusive examples of a portion of probe head assemblies 100according to the present disclosure. The probe head assemblies of FIGS.2-3 may be substantially similar to the probe head assembly of FIG. 1but provide additional, less schematic, but still illustrative,non-exclusive examples of riser 170, space transformer 150, and/orcontacting assembly 200. In addition to the illustrated components, theprobe head assemblies of FIGS. 2 and 3 may include one or more othercomponents, as discussed in more detail herein with reference to FIG. 1.

Space transformer 150 may include a wide pitch surface 152 that includea plurality of wide pitch contact pads 154 that are separated by anaverage wide pitch spacing 160. Similarly, the space transformer alsomay include a narrow pitch surface 156 that includes a plurality ofnarrow pitch contact pads 158 that are separated by an average narrowpitch spacing 162. A plurality of space transformer conduits 164 mayconvey the plurality of test signals between respective wide pitchcontact pads and respective narrow pitch contact pads, as schematicallyillustrated in FIG. 2.

Thus, the average wide pitch spacing is greater than the average narrowpitch spacing, and space transformer 150 is configured to change, ortransform, the average spacing of the plurality of contact pads that arepresent therein from the average wide pitch spacing to the averagenarrow pitch spacing. Illustrative, non-exclusive examples of spacetransformers according to the present disclosure include any suitableprinted circuit board, multilayer ceramic circuit, application-specificspace transformer, space transformer (which optionally may be acustomer-supplied space transformer), integrated circuit package,unpackaged integrated circuit device, and/or redistribution layer (whichmay be present on a surface of any of the preceding illustrative,non-exclusive examples of space transformers). When space transformer150 includes and/or is a printed circuit board, probe head assembly 100additionally or alternatively may be, include, and/or be referred toherein as a probe card assembly 100.

Contacting assembly 200 may include flexible dielectric body 204 and aplurality of conductive probes 250 that are configured to extend betweenfirst body surface 206 and second body surface 208 and to convey theplurality of test signals therebetween. Flexible dielectric body 204additionally or alternatively may be referred to herein as flexibledielectric membrane 204. As shown in FIGS. 2-3, the plurality ofconductive probes may include any suitable shape, illustrative,non-exclusive examples of which include a rocking beam probe 252 and/oran elongate probe 254. Similarly, a probe tip 270 of the conductiveprobes that is configured to contact the device under test may includeany suitable shape, illustrative, non-exclusive examples of whichinclude a blunt tip 255, a pointed tip 256, a rounded tip 257, atruncated tip 258, and/or a dual-faceted tip 259. Illustrative,non-exclusive examples of contacting assemblies 200 and/or conductiveprobes 250 according to the present disclosure are discussed in moredetail herein with reference to FIGS. 7-11.

In contrast to space transformer 150, riser 170 may include a pluralityof test signal conduits 174 and may be configured to maintain, or atleast approximately maintain, a spacing of the plurality of test signalconduits between a first riser surface 176 and second riser surface 180.Thus, and although not required to all embodiments, it is within thescope of the present disclosure that riser 170 optionally may not beconfigured to function as a space transformer and/or may not be a spacetransforming device. Additionally or alternatively, and in contrast tospace transformer 150, riser 170 may be configured to convey theplurality of test signals between the plurality of conductive probes 250of contacting assembly 200 and space transformer 150 on a linear, or atleast substantially linear, conduction path via test signal conduits174.

In the illustrative, non-exclusive example of FIG. 2, riser 170 includesa plurality of second riser surface contact pads 182 that are configuredto form a connection with narrow pitch contact pads 158 of spacetransformer 150 and to convey the plurality of test signals between thespace transformer and the riser. Test signal conduits 174 interconnectthe plurality of second riser surface contact pads 182 with a pluralityof first riser surface contact pads 178, which are configured to form aconnection with conductive probes 250 and to convey the plurality oftest signals between contacting assembly 200 and the riser. As discussedin more detail herein, a pitch, or spacing, between the plurality offirst riser surface contact pads 178 may be similar to a pitch, orspacing, between the plurality of second riser surface contact pads 182.

In addition, and as shown in FIG. 2, a selected first riser surfacecontact pad may be opposed, or at least substantially opposed, to arespective second riser surface contact pad. Thus, test signal conduits174 may include a longitudinal axis that is parallel to, or at leastsubstantially parallel to, a surface normal direction of first risersurface 176 and/or second riser surface 180. This surface normaldirection also may be referred to herein as a direction that isperpendicular to a plane that is parallel to first riser surface 176and/or second riser surface 180.

Riser 170 may include and/or be a rigid, or at least substantiallyrigid, riser 184 that is not configured to deform, or substantiallydeform, when placed within probe head assembly 100 and/or utilized totest a DUT. Additionally or alternatively, the riser also may includeand/or be a resilient riser 186 that is configured to deform when placedwithin the probe head assembly and/or utilized to test a DUT. As shownin dashed lines in FIG. 2 and discussed in more detail herein withreference to FIGS. 4-5, riser 170 may include a composite riser 188,which also may be referred to herein as a composite riser assembly 188,that includes a plurality of riser layers 190.

It is within the scope of the present disclosure that first risersurface 176 may be parallel to, or at least substantially parallel to,narrow pitch surface 156 of space transformer 150. Alternatively, it isalso within the scope of the present disclosure that at least a portionof first riser surface 176 may not be parallel to narrow pitch surface156. As an illustrative, non-exclusive example, and with reference toFIG. 1, first riser surface 176 may be lapped, polished, and/orotherwise planarized to be parallel to, or at least substantiallyparallel to, any suitable reference plane and/or surface. Illustrative,non-exclusive examples of reference planes and/or surfaces according tothe present disclosure include any suitable device under test proximalside, and/or device under test distal side, of a component of probe headassembly 100, such as stiffener 110, printed circuit board 120, widepitch interposer 130, space transformer riser 140, probe head frame 142,and/or space transformer 150.

As shown in dashed lines in FIG. 2, space transformer 150, riser 170,and/or contacting assembly 200 may include and/or be operativelyattached to one or more surface-mounted electronic components 144.Surface-mounted electronic components 144 may be and/or includeelectronic devices that are attached, such as by compressive force,pressure, clamping, adhesion, and/or soldering, to a suitable surfaceand are configured to interact with and/or alter one or more of the testsignals in any suitable manner. Illustrative, non-exclusive examples ofsurface-mounted electronic components 144 that may be utilized with thesystems, probe head assemblies, and/or methods according to the presentdisclosure include active electronic components, passive electroniccomponents, electronic filters, capacitors, inductors, resistors,transistors, and/or integrated circuits.

As shown in FIG. 2, riser 170 may be configured to provide clearance forthe one or more surface-mounted electronic components 144, such as toprevent and/or decrease a potential for physical contact between thesurface-mounted electronic components and portions of the probe headassembly upon which the surface-mounted electronic component is notmounted. As an illustrative, non-exclusive example, riser 170 may definean air gap 198 between space transformer 150 and contacting assembly200, and the surface-mounted electronic component may be present withinthe air gap.

It is within the scope of the present disclosure that any of the probehead assemblies 100, space transformers 150, risers 170, and/orcontacting assemblies 200 disclosed herein may include one or moresurface-mounted electronic components. These surface-mounted electroniccomponents may be located at any suitable location within the probe headassembly and/or may perform any suitable function within the probe headassembly.

In the illustrative, non-exclusive example of FIG. 3, riser 170 includesa resilient riser 186 that is configured to deform when placed withinprobe head assembly 100 and/or utilized to test the DUT. Resilient riser186 may include a plurality of test signal conduits 174 that arecontained at least partially within a resilient dielectric riser body187, include a spacing that is less than a spacing of conductive probes250 and/or narrow-pitch contact pads 158, and are oriented at an angle,such as a skew angle, with respect the surface normal direction of firstriser surface 176 and/or second riser surface 180. Thus, and as shown inFIG. 3, a plurality of test signal conduits 174 may form the connectionbetween a selected conductive probe 250 and a respective narrow-pitchcontact pad 158. In addition, and due to the angled orientation of theplurality of test signal conduits 174 with respect to the surface normaldirection, narrow-pitch contact pads 158 may be spatially offset fromconductive probes 250 within the probe head assembly to provide for theconnection therebetween via test signal conduits 174. As shown in dashedlines in FIG. 3, space transformer 150 may (but is not required to)include rigid fine pitch riser 159, which may increase a thickness ofthe space transformer and/or increase a distance between wide pitchsurface 152 and narrow pitch surface 156 of the space transformer.

FIGS. 4-5 are schematic cross-sectional views of illustrative,non-exclusive examples of risers 170 in the form of composite risers188, which also may be referred to herein as composite riser assemblies188, according to the present disclosure. In FIG. 4, the composite riserincludes two riser layers 190 including a first riser 192 (or firstriser layer 192) and a second riser 196 (or second riser layer 196).First riser layer 192 may be a rigid riser 184 that includes a rigiddielectric riser body 185 and a plurality of test signal conduits 174that convey the plurality of test signals through the riser in adirection that at least substantially parallel to a surface normaldirection of first riser surface 176 and/or second riser surface 180. Incontrast, second riser layer 196 may be a resilient riser 186 thatincludes a resilient dielectric riser body 187, which may include and/orbe formed from silicone, and a plurality of test signal conduits 174that are oriented at an angle, such as a skew angle, with respect to thesurface normal direction of first riser surface 176 and/or second risersurface 180. Thus, and as shown in dashed lines in FIG. 4, a contact pad166 that is configured to contact first riser surface 176 may bespatially offset from a contact pad 168 that is configured to contactsecond riser surface 180. It is within the scope of the presentdisclosure that the particular angles to be utilized may vary, such asaccording to one or more of the particular embodiment being utilized,design preferences, spatial constraints, desired contact pad alignment,materials of construction, etc. Furthermore, while some embodiments mayutilize test signal conduits 174 that extend at skew, or otherwiseinclined, angles, the use of test signal conduits 174 that extendparallel to the surface normal direction is not precluded and instead iswithin the scope of the present disclosure.

In FIG. 5, the composite riser includes three riser layers 190 includingfirst riser layer 192, intermediate riser layer 194, and second riserlayer 196. First riser layer 192 and second riser layer 196 may includeresilient risers 186 that are similar to second riser layer 196 of FIG.4, while intermediate riser layer 194 may include a rigid riser 184 thatis similar to first riser layer 192 of FIG. 4. Angled test signalconduits 174 of first riser layer 192 may be oriented in an oppositedirection from the angled test signal conduits of second riser layer196. Thus, and as shown in dashed lines in FIG. 5, a contact pad 166that is configured to contact first riser surface 176 may be opposed to,or at least substantially opposed to, a contact pad 168 that isconfigured to contact second riser surface 180. While only a singleintermediate riser layer 194 is shown in FIG. 5, it is within the scopeof the present disclosure that composite riser 188 may include aplurality of intermediate riser layers.

As shown in dashed lines in FIGS. 4-5, one or more selected riser layers190 may include one or more extension regions 193 that may extend past aremainder of the riser layers of composite riser 188. The extensionregion(s) may serve as a mounting location for one or moresurface-mounted electronic components 144, illustrative, non-exclusiveexamples of which are discussed in more detail herein.

FIG. 6 is a schematic cross-sectional view of another illustrative,non-exclusive example of a probe head assembly 100 according to thepresent disclosure. In particular, FIG. 6 illustrates a probe headassembly 100 that includes an illustrative, non-exclusive example of acomposite riser 188. The probe head assembly of FIG. 6 is substantiallysimilar to the probe head assemblies of FIGS. 2-3, with like numbersdenoting like components. Accordingly, the preceding discussion ofcomponents, elements, subelements, materials of construction, variants,etc. from FIGS. 2-3 may apply to the probe head assembly of FIG. 6, inwhich all of the reference numbers from FIGS. 2-3 have not been repeatedin an effort to simplify the presentation of the further illustrativeembodiment. However, and as mentioned, riser 170 of FIG. 6 may includeand/or be a composite riser 188. As illustrated, composite riser 188includes riser layers 190, in the form of rigid riser 184 and resilientriser 186, and may be the same as (or substantially similar to) thecomposite riser of FIG. 4. As shown in FIG. 6, rigid riser 184 may belocated between resilient riser 186 and space transformer 150 and mayspatially separate resilient riser 186 and/or contacting assembly 200from space transformer 150, thereby creating and/or defining an air gap198 between the space transformer and the contacting assembly. Air gap198 may provide clearance for one or more surface-mounted electroniccomponents 144, as shown. It is also within the scope of the presentdisclosure that probe head assembly 100 may be formed with the compositeriser 188 that is shown in FIG. 5.

When riser 170 is a composite riser 188 with a plurality of riser layers190, the riser layers may be maintained in contact and/or electricalcommunication with one another, with space transformer 150, and/or withcontacting assembly 200 in any suitable manner and/or via any suitablemechanism. As an illustrative, non-exclusive example, a compressiveforce may maintain the contact and/or electrical communication. Asanother illustrative, non-exclusive example, first riser layer 192 maybe operatively attached to, fabricated on, and/or form a portion ofspace transformer 150. When first riser layer 192 is operativelyattached to, is fabricated on, and/or forms a portion of spacetransformer 150 and includes rigid riser layer 184, first riser layer192 also may be, include, and/or be referred to herein as rigid finepitch riser 159. As yet another illustrative, non-exclusive example, aselected riser layer may be operatively attached to an adjacent, oropposed, riser layer. It is within the scope of the present disclosurethat riser layers 190 may be operatively attached to one another, tospace transformer 150, and/or to contacting assembly 200 in any suitablemanner, illustrative, non-exclusive examples of which include beingbonded, adhered, and/or soldered.

FIG. 7 is a schematic cross-sectional view of illustrative,non-exclusive examples of a test system 20 that may utilize an externaltest signal lead 38 according to the present disclosure. The test systemof FIG. 7 includes at least space transformer 150, riser 170, contactingassembly 200, and one or more external test leads 38. Similar to thetest system of FIG. 1, probe head frame 142 may be operatively attachedto space transformer riser 140 and may be configured to locate the spacetransformer riser with respect to a portion of the probe head assembly.In addition, and also similar to the test system of FIG. 1, a frame 240may be operatively attached to probe head frame 142 and may beconfigured to locate contacting assembly 200 with respect to a remainderof the probe head assembly. As shown in FIG. 7, and also similar to FIG.1, a first portion of the plurality of test signals is conveyed betweencontrol system 30 and conductive probes 250 of contacting assembly 200by traveling, or passing, through at least space transformer 150 andriser 170 and also may travel vertically through space transformer riser140, as shown.

As an illustrative, non exclusive example, and depending on the natureof test signals 36 and/or the construction of probe head assembly 100,at least a portion of the test signals may degrade if passed throughspace transformer riser 140, space transformer 150, riser 170, and/orcontacting assembly 200. Thus, and to improve signal integrity of theportion of the plurality of test signals the one or more external testsignal leads may be utilized. Such external test signal leads may beused for test signals that do not degrade, or substantially degrade, ifpassed through space transformer riser 140, space transformer 150, riser170, and/or contacting assembly 200. As shown in FIG. 7, test system 20optionally may include one or more external test signal leads 38, whichmay bypass at least a portion of the probe head assembly and/or providethe portion of the plurality of test signals directly between two ormore components of the probe head assembly. In other words, and in theillustrative, non-exclusive example of FIG. 7, at least a second portionof the plurality of test signals 36, which also may be referred toherein an external test signal, is conveyed between control system 30and conductive probes 250 via one or more external test signal leads 38that may bypass at least one of space transformer riser 140, spacetransformer 150, and/or riser 170.

As an illustrative, non-exclusive example, and as indicated in FIG. 7 at40, the external test signal may be conveyed directly between controlsystem 30 and contacting assembly 200. As another illustrative,non-exclusive example, and as indicated at 41, the external test signalmay be conveyed directly between control system 30 and riser 170, withriser 170 conveying the external test signal to and/or from contactingassembly 200. As another illustrative, non-exclusive example, and asindicated at 42, the external test signal may be conveyed directlybetween control system 30 and space transformer 150, with spacetransformer 150 and riser 170 conveying the external test signal toand/or from contacting assembly 200. As another illustrative,non-exclusive example, and as indicated at 43, the external test signalmay be conveyed between space transformer riser 140 and riser 170,bypassing space transformer 150. As another illustrative, non-exclusiveexample, and as indicated at 44, the external test signal may beconveyed between space transformer 150 and contacting assembly 200,bypassing riser 170. As yet another illustrative, non-exclusive example,and as indicated at 45, the external test signal may be conveyed betweenspace transformer riser 140 and contacting assembly 200, bypassing spacetransformer 150 and riser 170.

External test signal lead 38 may include any suitable structure, such asa conductive trace, that is configured to convey the external testsignal on a path that is external to one or more of spacer transformerriser 140, space transformer 150, and/or riser 170. Illustrative,non-exclusive examples of external test signal leads 38 according to thepresent disclosure include a controlled impedance structure, a stripline structure, a co-planar structure, a waveguide, and/or a fiber opticcable.

It is within the scope of the present disclosure that probe headassembly 100 may be configured to convey the plurality of test signalsbetween DUT 60 and control system 30 without transferring any of theplurality of test signals along a conductive trace that is present on asurface of and/or within flexible dielectric body 204 of contactingassembly 200. However, it is also within the scope of the presentdisclosure that external test signal lead 38 may include a conductivetrace that may be present on the surface of and/or within the flexibledielectric body. In addition, and while only discussed herein withreference to FIG. 7, it is within the scope of the present disclosurethat any of the test systems 20 and/or probe head assemblies 100disclosed herein may include and/or utilize one or more external testsignal leads 38.

FIG. 8 is a schematic representation of an illustrative, non-exclusiveexample of a contacting assembly 200 according to the presentdisclosure. Contacting assembly 200 includes a frame 240 that defines anaperture 242. A flexible dielectric body 204 is operatively attached toframe 240, is maintained in tension by frame 240, and extends acrossaperture 242 thereof. A plurality of conductive probes 250 isoperatively attached to flexible dielectric body 204. As discussed inmore detail herein, flexible dielectric body 204 and conductive probes250 may form a portion of a membrane probe assembly 202.

Test systems 20 and/or probe head assemblies 100 that include contactingassembly 200 of FIG. 8 may be configured for operation, or to test thedevice under test, at a plurality of different temperatures thatincludes at least a minimum temperature and a maximum temperature,wherein the minimum temperature and the maximum temperature define athreshold temperature range. Illustrative, non-exclusive examples ofminimum temperatures according to the present disclosure include minimumtemperatures of, or of less than, −50 degrees C., −40 degrees C., −30degrees C., −20 degrees C., −10 degrees C., 0 degrees C., 10 degrees C.,20 degrees C., 30 degrees C., 40 degrees C., 50 degrees C., 60 degreesC., or 70 degrees C. Illustrative, non-exclusive examples of maximumtemperatures according to the present disclosure include maximumtemperatures of, or of at least, 90 degrees C., 100 degrees C., 110degrees C., 120 degrees C., 130 degrees C., 140 degrees C., 150 degreesC., 160 degrees C., 170 degrees C., or 180 degrees C. Illustrative,non-exclusive examples of threshold temperature ranges according to thepresent disclosure include threshold temperature ranges of at least 20degrees C., at least 30 degrees C., at least 40 degrees C., at least 50degrees C., at least 60 degrees C., at least 70 degrees C., at least 80degrees C., at least 90 degrees C., at least 100 degrees C., at least110 degrees C., at least 120 degrees C., at least 130 degrees C., atleast 140 degrees C., at least 150 degrees C., at least 160 degrees C.,at least 170 degrees C., or at least 180 degrees C.

When test systems 20 are operated at a plurality of differenttemperatures, thermally induced expansion and/or contraction of thecomponents thereof may produce misalignment of conductive probes 250relative to respective contact pads on a device under test that theconductive probes are configured to contact. As an illustrative,non-exclusive example, when flexible dielectric body 204 has acoefficient of thermal expansion that differs significantly from thecoefficient of thermal expansion of the device under test, changes intemperature may produce the misalignment due to differences in theexpansion and/or contraction of flexible dielectric body 204 relative tothe device under test.

In order to maintain contact between the plurality of conductive probesand the respective contact pads on the device under test, flexibledielectric body 204 may be maintained in tension within frame 240throughout the threshold temperature range, and frame 240 may beselected from a material that has a coefficient of thermal expansionthat is within a threshold difference of a coefficient of thermalexpansion of the device under test. Thus, frame 240 may expand and/orcontract at a rate that is comparable to an expansion and/or contractionrate of the device under test, expand and/or contract flexibledielectric body 204 at a comparable rate, and maintain contact and/oralignment between the plurality of conductive probes and the respectivecontact pads on the device under test. Additionally or alternatively,the coefficient of thermal expansion of frame 240 may be selected to begreater than a coefficient of thermal expansion of flexible dielectricbody 204, which also may serve to maintain the flexible dielectric bodyin tension throughout the threshold temperature range.

Illustrative, non-exclusive examples of threshold coefficient of thermalexpansion differences according to the present disclosure includethreshold differences of less than 25%, less than 20%, less than 15%,less than 10%, less than 5%, less than 4%, less than 3%, less than 2%,less than 1%, less than 0.5%, less than 0.1%, substantially zero, orzero. As an illustrative, non-exclusive example the frame and the deviceunder test may be constructed from the same, or substantially the same,material, and the threshold coefficient of thermal expansion differencemay be substantially zero, or zero.

It is within the scope of the present disclosure that contactingassembly 200 of FIG. 8 may be utilized with any of the test systems 20and/or probe head assemblies 100 that are disclosed herein. When thecontacting assembly is mounted and/or utilized within a probe headassembly 100, frame 240 may be configured to stretch flexible dielectricbody 204 across a surface of a riser to maintain contact between theplurality of conductive probes of the contacting assembly and the riser.It is also within the scope of the present disclosure that, as shown inFIG. 1, contacting assembly 200 may be mounted to probe head assembly100 from a side or region, of the probe head assembly that faces deviceunder test 60 during testing of the device under test.

FIGS. 9-12 are schematic cross-sectional views of illustrative,non-exclusive examples of a conductive probe 250 according to thepresent disclosure. Conductive probe 250 of FIGS. 9-12 may form aportion of a contacting assembly 200, a membrane probe assembly 202, aprobe head assembly 100, and/or a test system 20 and may be utilizedwith any of the systems and methods that are disclosed herein.

Conductive probe 250 includes a probe base 260 that is configured tooperatively attach the conductive probe to a flexible dielectric body204 of contacting assembly 200. The conductive probe also includes aprobe tip 270 that extends from probe base 260 and is configured toproject from a first body surface 206 of the flexible dielectric bodyand to electrically contact a device under test that is positionedtherebelow.

Probe base 260 may include any suitable structure that is configured tooperatively attach and/or retain conductive probe 250 within flexibledielectric body 204. As an illustrative, non-exclusive example, and asshown in FIGS. 9-12, probe base 260 may extend past a base of probe tip270 in a direction that is parallel to first body surface 206 offlexible dielectric body 204. This extension may provide one or morelight-reflecting surfaces that may improve optical alignment between theconductive probe and the device under test. As another illustrative,non-exclusive example, a projection of conductive probe 250 in adirection that is parallel to a surface normal of first body surface 206may include a geometric shape that may be readily recognized by probetip alignment software of test system 20. Illustrative, non-exclusiveexamples of geometric shapes according to the present disclosure includecircles, squares, rectangles, polygons, and/or trapezoids. As yetanother illustrative, non-exclusive example, and as shown in dashedlines in FIGS. 9-12, the probe base may include a rivet-shaped probebase 262 that includes a pair of spaced-apart, radially projectingridges 264, which also may be referred to herein as ridges 264.

Ridges 264 may be configured to provide an increased surface area for anadhesive bond between flexible dielectric body 204 and conductive probe250. Additionally or alternatively, the ridges also may be configured tocapture a portion of the flexible dielectric body therebetween and toretain the conductive probe within the flexible dielectric body despitedeformation of the flexible dielectric body due to the application ofone or more contact forces to the conductive probe. It is within thescope of the present disclosure that ridges 264 may extend any suitabledistance and/or amount from probe base 260 and/or probe base shaft 261.As illustrative, non-exclusive examples, and when probe base shaft 261includes a cylindrical probe base shaft with a probe base shaft outerdiameter, an outer diameter of ridges 264 may be at least 100%, at least150%, at least 200%, at least 250%, at least 300%, at least 400%, atleast 500%, at least 600%, at least 700%, at least 800%, at least 900%or at least 1000% of the probe base shaft outer diameter. Additionallyor alternatively, the outer diameter of ridges 264 may be less than1500%, less than 1250%, less than 1000%, less than 900%, less than 800%,less than 700%, less than 600%, or less than 500% of the probe baseshaft outer diameter.

In addition, and while rivet-shaped probe base 262 is only shown inFIGS. 9-12, it is within the scope of the present disclosure that therivet-shaped probe base may be utilized with any suitable conductiveprobe 250 that forms a portion of a contacting assembly 200. Asillustrative, non-exclusive examples, rivet-shaped probe base 262 may beutilized with any suitable rocking beam probe and/or elongate probe thatincludes any suitable tip shape, including a blunt tip, a pointed tip, arounded tip, a truncated tip, and/or a dual-faceted tip.

Probe tip 270 includes a dual-faceted shape 259 and may be referred toherein as dual-faceted probe tip 270. The dual-faceted shape includes anelongate apex 274 that is configured to penetrate a contacted portion ofthe device under test, a wedge-shaped region 278 that includes theelongate apex, and/or extends therefrom, to define a wedge angle 282,and an extension region 286 that tapers from the probe base to thewedge-shaped region and defines a taper angle 290.

FIG. 9 is a cross-sectional view of a conductive probe 250 that is takenalong a plane that is perpendicular to elongate apex 274 and parallel toa longitudinal axis 288 of the conductive probe. In contrast, FIG. 10 isa cross-section view of a similar conductive probe 250 that is takenalong a plane that is parallel to the elongate apex and parallel tolongitudinal axis 288 of the conductive probe. Thus, FIGS. 9-10 providecomplementary, or perpendicular, views of the same conductive probestructure. In contrast, FIGS. 11-12 provide illustrative, non-exclusiveexamples of additional and/or alternatively conductive probes 250according to the present disclosure.

As perhaps best shown in FIGS. 9 and 12, conductive probes 250 accordingto the present disclosure may include a symmetrical, or at leastsubstantially symmetrical, cross-sectional shape, at least in a planethat is perpendicular to elongate apex 274 and parallel to longitudinalaxis 288. As also shown in FIGS. 9 and 12, wedge-shaped region 278 mayinclude a first wedge surface 279 and a second wedge surface 280, withwedge angle 282 being defined by an angle of intersection between thefirst wedge surface and the second wedge surface and/or as an angle ofintersection between a plane that is parallel to the first wedge surfaceand a plane that is parallel to the second wedge surface. Illustrative,non-exclusive examples of wedge angles 282 according to the presentdisclosure include wedge angles of less than 150 degrees, less than 140degrees, less than 130 degrees, less than 120 degrees, less than 110degrees, less than 100 degrees, or less than 90 degrees, and/or wedgeangles of greater than 70 degrees, greater than 80 degrees, greater than90 degrees, greater than 100 degrees, greater than 110 degrees, greaterthan 120 degrees, or greater than 130 degrees. As perhaps best shown inFIG. 10, a longitudinal axis 276 of elongate apex 274 may define, becoextensive with, and/or be parallel to, a line of intersection betweenthe first wedge surface and the second wedge surface.

With continued reference to FIGS. 9 and 12, extension region 286 mayinclude a first extension surface 287, which extends between probe base260 and first wedge surface 279, and a second extension surface 289,which extends between probe base 260 and second wedge surface 280. Taperangle 290 may be defined as an angle of intersection between firstextension surface 287 and first wedge surface 279 and/or as an angle ofintersection between second extension surface 289 and second wedgesurface 280. Illustrative, non-exclusive examples of taper angles 290according to the present disclosure include taper angles of less than180 degrees, less than 175 degrees, less than 170 degrees, less than 165degrees, less than 160 degrees, less than 155 degrees, less than 150degrees, less than 145 degrees, less than 140 degrees, less than 135degrees, less than 130 degrees, less than 125 degrees, less than 120degrees, less than 115 degrees, less than 110 degrees, less than 105degrees, or less than 100 degrees, and/or taper angles of greater than90 degrees, greater than 95 degrees, greater than 100 degrees, greaterthan 105 degrees, greater than 110 degrees, greater than 115 degrees,greater than 120 degrees, greater than 125 degrees, greater than 130degrees, greater than 135 degrees, greater than 140 degrees, or greaterthan 145 degrees.

As shown in FIGS. 9 and 12 and discussed herein, taper angle 290includes a non-zero taper angle. Thus, first extension surface 287 isnot parallel to first wedge surface 279. Similarly, second extensionsurface 289 is not parallel to second wedge surface 280.

As perhaps best shown in FIG. 10, conductive probes 250 according to thepresent disclosure may be constructed such that a line of intersectionbetween first wedge surface 279 and first extension surface 287 and/or aline of intersection between second wedge surface 280 and secondextension surface 289 may be parallel, or at least substantiallyparallel, to first body surface 206 of flexible dielectric body 204 whenthe flexible dielectric body is in an undeformed state. Similarly,longitudinal axis 276 of elongate apex 274 may be parallel, or at leastsubstantially parallel, to the first body surface when the flexibledielectric body is in the undeformed state.

Alternatively, and as perhaps best shown in FIG. 11, conductive probes250 according to the present disclosure also may be constructed suchthat longitudinal axis 276 of elongate apex 274 is at a skew apex angle275 with respect to first body surface 206 of flexible dielectric body204 when the flexible dielectric body is in the undeformed state.Illustrative, non-exclusive examples of skew apex angles 275 accordingto the present disclosure include skew apex angles of less than 45degrees, less than 40 degrees, less than 35 degrees, less than 30degrees, less than 25 degrees, less than 20 degrees, less than 15degrees, less than 10 degrees, or less than 5 degrees, and/or skew apexangles of greater than 1 degree, greater than 2 degrees, greater than 3degrees, greater than 4 degrees, greater than 5 degrees, greater than 10degrees, or greater than 15 degrees.

Elongate apex 274 may include any suitable length when measured alonglongitudinal axis 276 thereof. As illustrative, non-exclusive examplesthe length of the elongate apex may be at least 25 micrometers (um), atleast 30 um, at least 35 um, at least 40 um, at least 45 um, at least 50um, at least 55 um, at least 60 um, or at least 65 um. Additionally oralternatively, the length of the elongate apex may be less than 105 um,less than 100 um, less than 95 um, less than 90 um, less than 85 um,less than 80 um, less than 75 um, less than 70 um, or less than 65 um.

Additionally or alternatively, the elongate apex may be configured toform the electrical connection with a contact surface on the deviceunder test that includes a characteristic dimension, such as acharacteristic diameter, equivalent diameter, and/or maximum dimensionof the contact surface, and the length of the elongate apex may beselected based, at least in part, on the characteristic dimension of thecontact surface. As illustrative, non-exclusive examples, the elongateapex may be less than 150%, less than 140%, less than 130%, less than120%, less than 110%, less than 100%, less than 90%, less than 80%, lessthan 70%, or less than 60% of the characteristic dimension of thecontact surface, and/or greater than 15%, greater than 20%, greater than25%, greater than 30%, greater than 35%, greater than 40%, greater than45%, greater than 50%, greater than 55%, or greater than 60% of thecharacteristic dimension of the contact surface.

As perhaps best shown in FIG. 10, extension region 286 of conductiveprobes 250 according to the present disclosure also may include a thirdextension surface 296 and a fourth extension surface 298, each of whichmay extend from probe base 260 to elongate apex 274, with elongate apex274 extending between third extension surface 296 and fourth extensionsurface 298.

Third extension surface 296 and/or fourth extension surface 298 may beperpendicular, or at least substantially perpendicular, to firstextension surface 287 and/or second extension surface 289 and an angleof intersection between the third extension surface and the elongateapex and/or between the fourth extension surface and the elongate apexmay define a second taper angle 294. Illustrative, non-exclusiveexamples of second taper angles 294 according to the present disclosureinclude second taper angles of less than 180 degrees, less than 175degrees, less than 170 degrees, less than 165 degrees, less than 160degrees, less than 155 degrees, less than 150 degrees, less than 145degrees, less than 140 degrees, less than 135 degrees, less than 130degrees, less than 125 degrees, less than 120 degrees, less than 115degrees, less than 110 degrees, less than 105 degrees, or less than 100degrees, and/or second taper angles of greater than 90 degrees, greaterthan 95 degrees, greater than 100 degrees, greater than 105 degrees,greater than 110 degrees, greater than 115 degrees, greater than 120degrees, greater than 125 degrees, greater than 130 degrees, greaterthan 135 degrees, greater than 140 degrees, or greater than 145 degrees.

The systems, probe head assemblies, components thereof, and methodsdisclosed herein have been discussed in the context of a test systemthat includes a single probe head assembly with a single contactingassembly that is configured to form a plurality of connections withand/or to test a single DUT. It is within the scope of the presentdisclosure that, subsequent to testing a first DUT of a plurality ofDUTs that may be present on a substrate, the systems, probe headassemblies, components thereof, and/or methods may be utilized to test asecond, or subsequent, DUT of the plurality of DUTs. This may includetesting a selected portion, a majority, and/or all of the DUTs that maybe present on the substrate.

Additionally or alternatively, it is also within the scope of thepresent disclosure that the test system may include a plurality of probehead assemblies that is configured to simultaneously, or concurrently,test a plurality of devices under test. Similarly, the probe headassembly may include a plurality of contacting assemblies that areconfigured to simultaneously contact a plurality of DUTs and/or a singlecontacting assembly may be configured to simultaneously contact theplurality of DUTs. When the systems and methods are utilized tosimultaneously contact the plurality of DUTs, the systems and methodsmay be configured to align the contacting assembly with a respective DUTof the plurality of DUTs independently from a remainder of the pluralityof DUTs. Thus, test systems, probe head assemblies, and/or contactingassemblies according to the present disclosure may be utilized forseries, parallel, and/or series-parallel testing of the plurality ofDUTs that may be present on the substrate.

As used herein, the term “and/or” placed between a first entity and asecond entity means one of (1) the first entity, (2) the second entity,and (3) the first entity and the second entity. Multiple entities listedwith “and/or” should be construed in the same manner, i.e., “one ormore” of the entities so conjoined. Other entities may optionally bepresent other than the entities specifically identified by the “and/or”clause, whether related or unrelated to those entities specificallyidentified. Thus, as a non-limiting example, a reference to “A and/orB,” when used in conjunction with open-ended language such as“comprising” may refer, in one embodiment, to A only (optionallyincluding entities other than B); in another embodiment, to B only(optionally including entities other than A); in yet another embodiment,to both A and B (optionally including other entities). These entitiesmay refer to elements, actions, structures, steps, operations, values,and the like.

As used herein, the phrase “at least one,” in reference to a list of oneor more entities should be understood to mean at least one entityselected from any one or more of the entity in the list of entities, butnot necessarily including at least one of each and every entityspecifically listed within the list of entities and not excluding anycombinations of entities in the list of entities. This definition alsoallows that entities may optionally be present other than the entitiesspecifically identified within the list of entities to which the phrase“at least one” refers, whether related or unrelated to those entitiesspecifically identified. Thus, as a non-limiting example, “at least oneof A and B” (or, equivalently, “at least one of A or B,” or,equivalently “at least one of A and/or B”) may refer, in one embodiment,to at least one, optionally including more than one, A, with no Bpresent (and optionally including entities other than B); in anotherembodiment, to at least one, optionally including more than one, B, withno A present (and optionally including entities other than A); in yetanother embodiment, to at least one, optionally including more than one,A, and at least one, optionally including more than one, B (andoptionally including other entities). In other words, the phrases “atleast one,” “one or more,” and “and/or” are open-ended expressions thatare both conjunctive and disjunctive in operation. For example, each ofthe expressions “at least one of A, B and C,” “at least one of A, B, orC,” “one or more of A, B, and C,” “one or more of A, B, or C” and “A, B,and/or C” may mean A alone, B alone, C alone, A and B together, A and Ctogether, B and C together, A, B and C together, and optionally any ofthe above in combination with at least one other entity.

In the event that any patents, patent applications, or other referencesare incorporated by reference herein and define a term in a manner orare otherwise inconsistent with either the non-incorporated portion ofthe present disclosure or with any of the other incorporated references,the non-incorporated portion of the present disclosure shall control,and the term or incorporated disclosure therein shall only control withrespect to the reference in which the term is defined and/or theincorporated disclosure was originally present.

As used herein the terms “adapted” and “configured” mean that theelement, component, or other subject matter is designed and/or intendedto perform a given function. Thus, the use of the terms “adapted” and“configured” should not be construed to mean that a given element,component, or other subject matter is simply “capable of” performing agiven function but that the element, component, and/or other subjectmatter is specifically selected, created, implemented, utilized,programmed, and/or designed for the purpose of performing the function.It is also within the scope of the present disclosure that elements,components, and/or other recited subject matter that is recited as beingadapted to perform a particular function may additionally oralternatively be described as being configured to perform that function,and vice versa.

Illustrative, non-exclusive examples of systems and methods according tothe present disclosure are presented in the following enumeratedparagraphs. It is within the scope of the present disclosure that anindividual step of a method recited herein, including in the followingenumerated paragraphs, may additionally or alternatively be referred toas a “step for” performing the recited action.

A1. A probe head assembly for testing a device under test, the probehead assembly comprising:

a space transformer;

a contacting assembly that includes a flexible dielectric body with afirst body surface and an opposed second body surface, wherein thecontacting assembly includes a plurality of conductive probes, andfurther wherein the plurality of conductive probes is configured to forma plurality of test contacts with the device under test and to convey aplurality of test signals between the first body surface and the opposedsecond body surface;

means for spatially separating the space transformer from the contactingassembly; and

means for conveying the plurality of test signals between the pluralityof conductive probes and the space transformer.

A2. The probe head assembly of paragraph A1, wherein the means forspatially separating includes a riser.

A3. The probe head assembly of any of paragraphs A1-A2, wherein themeans for conveying includes a/the riser.

B1. A probe head assembly for testing a device under test, the probehead assembly comprising:

a space transformer;

a contacting assembly that includes a flexible dielectric body with afirst body surface and an opposed second body surface, wherein thecontacting assembly includes a plurality of conductive probes, andfurther wherein the plurality of conductive probes is configured to forma plurality of test contacts with the device under test and to convey aplurality of test signals between the first body surface and the opposedsecond body surface; and

a riser configured to separate the space transformer from the contactingassembly and to convey the plurality of test signals between theplurality of conductive probes and the space transformer.

C1. The probe head assembly of any of paragraphs A2-B1, wherein theriser includes a planar riser.

C2. The probe head assembly of any of paragraphs A2-C1, wherein theriser includes a first riser surface and an opposed, second risersurface.

C3. The probe head assembly of any of paragraphs A2-C2, wherein athickness of the riser is at least one of at least 0.025 mm, at least0.5 mm, at least 0.75 mm, at least 0.1 mm, at least 0.2 mm, at least 0.3mm, at least 0.4 mm, at least 0.5 mm, at least 0.6 mm, at least 0.7 mm,at least 0.8 mm, at least 0.9 mm, or at least 1 mm and/or wherein thethickness of the riser is less than 3 mm, less than 2.75 mm, less than2.5 mm, less than 2.25 mm, less than 2 mm, less than 1.75 mm, less than1.5 mm, less than 1.25 mm, less than 1 mm, less than 0.9 mm, less than0.8 mm, less than 0.7 mm, less than 0.6 mm, or less than 0.5 mm.

C4. The probe head assembly of any of paragraphs A2-C3, wherein theriser includes a plurality of test signal conduits that are configuredto convey the plurality of test signals between the plurality ofconductive probes and the space transformer.

C5. The probe head assembly of paragraph C4, wherein the plurality oftest signal conduits includes a plurality of first ends proximal toa/the first riser surface and a plurality of second ends proximal toa/the second riser surface, and optionally wherein an average spacingbetween the plurality of first ends is at least one of substantiallysimilar to and similar to an average spacing between the plurality ofsecond ends.

C6. The probe head assembly of any of paragraphs C4-C5, wherein theplurality of test signal conduits includes at least one of a pluralityof metallic conduits, a plurality of electrical conduits, a plurality ofelectrically conductive conduits, a plurality of optical conduits, aplurality of optically conductive conduits, a plurality of waveguides,and a plurality of electromagnetic radiation conduits.

C7. The probe head assembly of any of paragraphs A2-C6, wherein theriser further includes a plurality of first riser surface contact padsand a plurality of second riser surface contact pads, and furtherwherein a selected one of a/the plurality of test signal conduits of theriser is in conductive communication with a selected one of theplurality of first riser surface contact pads and a selected one of theplurality of second riser surface contact pads.

C8. The probe head assembly of paragraph C7, wherein a pitch of theplurality of first riser surface contact pads is similar to a pitch ofthe plurality of second riser surface contact pads.

C9. The probe head assembly of any of paragraphs A2-C8, wherein theriser is not a space transforming device.

C10. The probe head assembly of any of paragraphs A2-C9, wherein theriser is configured to convey the plurality of test signals between theplurality of conductive probes and the space transformer on a pluralityof linear conduction paths.

C11. The probe head assembly of any of paragraphs A2-C10, wherein theriser includes a rigid riser.

C12. The probe head assembly of any of paragraphs A2-C10, wherein theriser is a resilient riser that includes a resilient dielectric riserbody, and optionally wherein the resilient dielectric riser body atleast one of includes silicone, is formed of silicone, and is silicone.

C13. The probe head assembly of any of paragraphs A2-C12, wherein theriser includes a composite riser assembly.

C14. The probe head assembly of paragraph C13, wherein the compositeriser assembly includes at least a first riser and a second riser,optionally wherein the first riser is configured to convey the pluralityof test signals between the plurality of conductive probes and thesecond riser, and further optionally wherein the second riser isconfigured to convey the plurality of test signals between the firstriser and the space transformer.

C15. The probe head assembly of paragraph C14, wherein at least one ofthe first riser and the second riser includes at least one of a/therigid riser and a/the resilient riser.

C16. The probe head assembly of paragraph C13, wherein the compositeriser assembly includes a first riser, an intermediate riser, and asecond riser, optionally wherein the first riser is configured to conveythe plurality of test signals between the plurality of conductive probesand the intermediate riser, optionally wherein the intermediate riser isconfigured to convey the plurality of test signals between the firstriser and the second riser, and further optionally wherein the secondriser is configured to convey the plurality of test signals between theintermediate riser and the space transformer.

C17. The probe head assembly of paragraph C16, wherein at least one ofthe first riser, the intermediate riser, and the second riser includesa/the resilient dielectric riser body and a plurality of conductiveresilient riser conduits.

C18. The probe head assembly of paragraph C17, wherein the resilientdielectric riser body includes silicone.

C19. The probe head assembly of any of paragraphs C16-C18, wherein atleast one of the first riser, the intermediate riser, and the secondriser includes a rigid dielectric riser body and a plurality ofconductive rigid riser conduits.

C20. The probe head assembly of any of paragraphs C16-C19, wherein thefirst riser includes a conductive probe-proximal surface, wherein thesecond riser includes a space transformer-proximal surface, and furtherwherein a plurality of conductive riser conduits conveys the pluralityof test signals between the plurality of conductive probes and the spacetransformer.

C21. The probe head assembly of paragraph C20, wherein a spacetransformer-proximal end of the plurality of conductive riser conduitsintersect the space transformer-proximal surface at a location that issubstantially opposed to, or opposed to, a location where a conductiveprobe-proximal end of the plurality of conductive riser conduitsintersects the conductive probe-proximal surface.

C22. The probe head assembly of any of paragraphs C20-C21, wherein theplurality of conductive riser conduits passes through at least one ofthe first riser, the intermediate riser, and the second riser at a skewangle relative to a surface normal direction of at least one of theconductive probe-proximal surface and the space transformer-proximalsurface.

C23. The probe head assembly of any of paragraphs C16-C22, wherein theriser includes a plurality of intermediate layers.

C24. The probe head assembly of any of paragraphs A2-C23, wherein atleast one of the space transformer, the riser, and the contactingassembly includes one or more surface-mounted electronic components.

C25. The probe head assembly of paragraph C24, wherein the riser isconfigured to provide clearance for the one or more surface-mountedelectronic components, and optionally wherein the riser is configured todefine an air gap between the one or more surface-mounted electroniccomponents and at least one of the space transformer, the contactingassembly, and the riser.

C26. The probe head assembly of paragraph C25, wherein the riser isconfigured to prevent physical contact between the one or moresurface-mounted electronic components and a portion of at least one ofthe space transformer, the contacting assembly, and the riser that isnot configured to physically contact the one or more surface-mountedelectronic components.

C27. The probe head assembly of any of paragraphs C24-C26, wherein theriser is configured to prevent physical contact between the device undertest and a portion of the probe head assembly that does not include theplurality of conductive probes, and optionally wherein the riser isconfigured to define an/the air gap between the device under test andthe portion of the probe had assembly that does not include theplurality of conductive probes.

C28. The probe head assembly of any of paragraphs C24-C27, wherein theone or more surface-mounted electronic components includes at least oneof an active electronic component, a passive electronic component, anelectronic filter, a capacitor, an inductor, a resistor, a transistor,and an integrated circuit.

C29. The probe head assembly of any of paragraphs A2-C28, wherein theriser is fabricated separately from the space transformer.

C30. The probe head assembly of any of paragraphs A2-C29, wherein theriser is operatively attached to the space transformer, and optionallywherein the riser is at least one of adhered and soldered to the spacetransformer.

C31. The probe head assembly of any of paragraphs A2-C30, wherein theriser is in contact with the contacting assembly, and optionally whereinthe contact includes at least one of mechanical contact, conductivecontact, electrically conductive contact, and optically conductivecontact.

C32. The probe head assembly of paragraph C31, wherein the contactingassembly is tensioned across a surface of the riser, and further whereinthe tension generates a restoring force that maintains the contactingassembly in contact with the surface of the riser.

C33. The probe head assembly of any of paragraphs A2-C32, wherein theriser is at least one of not operatively attached to the contactingassembly and configured to be separated from the contacting assembly.

C34. The probe head assembly of any of paragraphs A2-C33, wherein theprobe head assembly is configured to convey the plurality of testsignals between the space transformer and the plurality of conductiveprobes without transferring any of the plurality of test signals along aconductive trace that is present on the flexible dielectric body of thecontacting assembly.

C35. The probe head assembly of any of paragraphs A2-C34, wherein theprobe head assembly is configured to convey an external test signal to aselected conductive probe of the contacting assembly without theexternal test signal passing through at least one of the riser and thespace transformer.

C36. The probe head assembly of any of paragraphs A2-C35, wherein theprobe head assembly includes an external test signal lead, and furtherwherein the external test signal lead is configured to provide an/theexternal test signal to a/the selected conductive probe of thecontacting assembly without the external test signal passing through atleast one of the riser and the space transformer.

C37. The probe head assembly of paragraph C36, wherein the external testsignal lead includes at least one of a conductive trace that is externalto at least one of the riser and the space transformer and a conductivetrace that is present on the flexible dielectric body of the contactingassembly.

C38. The probe head assembly of any of paragraphs A1-C37, wherein theplurality of test signals includes at least one of an electrical signal,an optical signal, an electromagnetic signal, electromagnetic radiation,an electric field, and a magnetic field.

C39. The probe head assembly of any of paragraphs A1-C38, wherein theplurality of test signals includes a plurality of discrete test signals.

C40. The probe head assembly of any of paragraphs A1-C39, wherein theprobe head assembly includes a plurality of contacting assembliesconfigured to test a plurality of devices under test, and optionallywherein the plurality of contacting assemblies is configured to test theplurality of devices under test at least partially concurrently.

C41. The probe head assembly of paragraph C40, wherein each of theplurality of contacting assemblies is associated with at least one of arespective space transformer and a respective riser.

C42. The probe head assembly of any of paragraphs C40-C41, wherein atleast a portion of the plurality of contacting assemblies is configuredto be aligned with a respective device under test independent of aremainder of the plurality of contacting assemblies.

C43. The probe head assembly of any of paragraphs A1-C42, wherein thespace transformer includes a planar space transformer.

C44. The probe head assembly of any of paragraphs A1-C43, wherein thespace transformer includes a wide-pitch surface with a plurality ofwide-pitch contact pads and an opposed narrow-pitch surface with aplurality of narrow-pitch contact pads, and further wherein an averagespacing between the plurality of wide-pitch contact pads is greater thanan average spacing between the plurality of narrow-pitch contact pads.

C45. The probe head assembly of any of paragraphs A1-C44, wherein thespace transformer includes at least one of a printed circuit board, anapplication-specific space transformer, a customer-supplied spacetransformer, and an integrated circuit package.

C46. The probe head assembly of any of paragraphs A1-C45, wherein thecontacting assembly includes a membrane probe assembly.

C47. The probe head assembly of any of paragraphs A1-C46, wherein thecontacting assembly is operatively attached to a frame configured tolocate the contacting assembly within the probe head assembly, andoptionally wherein the contacting assembly includes the frame.

C48. The probe head assembly of paragraph C47, wherein the frame isconfigured to tension the flexible dielectric body across a/the surfaceof a/the riser to maintain the flexible dielectric body in a stretchedstate when the frame is mounted in the probe head assembly, andoptionally wherein the flexible dielectric body extends past the surfaceof the riser and to the frame.

C49. The probe head assembly of any of paragraphs C47-C48, wherein theframe is configured to mount to the probe head assembly from a side ofthe probe head assembly that faces the device under test during testingof the device under test.

C50. The probe head assembly of any of paragraphs A1-C49, wherein thedevice under test includes at least one of an electronic device, anoptical device, and an optoelectronic device.

C51. The probe head assembly of any of paragraphs A1-050, wherein thedevice under test is fabricated on a substrate that includes a/theplurality of devices under test, and further wherein the probe headassembly is configured to test at least a portion of the plurality ofdevices under test that are present on the substrate at least one ofprior to singulation and after singulation of the plurality of devicesunder test.

C52. The probe head assembly of paragraph C51, wherein the substrateincludes at least one of a semiconductor wafer, a silicon wafer, agallium arsenide wafer, and a III-V semiconductor wafer.

C53. The probe head assembly of any of paragraphs A1-C52, wherein theprobe head assembly further includes a space transformer riser that islocated on a side of the space transformer that is opposed to thecontacting assembly.

C54. The probe head assembly of any of paragraphs A1-C53, wherein theprobe head assembly further includes a probe head frame, and optionallywherein the space transformer riser is operatively attached to the probehead frame.

C55. The probe head assembly of paragraph C54, wherein the probe headframe is operatively attached to a/the frame configured to locate thecontacting assembly within the probe head assembly.

C56. The probe head assembly of any of paragraphs A1-C55, wherein theprobe head assembly further includes a wide pitch interposer, optionallywherein the wide pitch interposer is located on a/the side of the spacetransformer that is opposed to the contacting assembly, and furtheroptionally wherein the wide pitch interposer is located on a side ofa/the space transformer riser that is opposed to the contactingassembly.

C57. The probe head assembly of any of paragraphs A1-C56, wherein theprobe head assembly further includes a printed circuit board, optionallywherein the printed circuit board is located on a/the side of the spacetransformer that is opposed to the contacting assembly, and furtheroptionally wherein the printed circuit board is located on a side ofa/the wide pitch interposer that is opposed to the contacting assembly.

C58. The probe head assembly of any of paragraphs A1-C57, wherein theprobe head assembly further includes a stiffener, optionally wherein thestiffener is located on a/the side of the space transformer that isopposed to the contacting assembly, further optionally wherein thestiffener is located on a side of a/the printed circuit board that isopposite to the contacting assembly, and further optionally whereina/the probe head frame is mounted to the stiffener.

C59. The probe head assembly of any of paragraphs A1-C58, wherein theprobe head assembly further includes a flexure, wherein the flexure isconfigured to limit a contact force that is applied to the device undertest by the probe head assembly.

C60. The probe head assembly of paragraph C59, wherein the flexure islocated on a/the side of the space transformer that is opposed to thecontacting assembly, and optionally wherein the flexure is locatedbetween a/the printed circuit board and the space transformer.

C61. The probe head assembly of any of paragraphs C59-C60, wherein theflexure includes at least one of a resilient material, a resilientmaterial with included conductive flexure conduits, and a buckling beam.

D1. A test system for testing a device under test, the test systemcomprising:

the probe head assembly of any of paragraphs A1-057; and

a chuck configured to locate the device under test with respect to theprobe head assembly.

D2. The test system of paragraph D1, wherein the test system furtherincludes a signal generator configured to generate an input signal,wherein the input signal forms a first portion of the plurality of testsignals.

D3. The test system of any of paragraphs D1-D2, wherein the test systemfurther includes a signal analyzer configured to receive an outputsignal, wherein the output signal forms a second portion of theplurality of test signals.

E1. A conductive probe configured to form an electrical connection witha device under test, the conductive probe comprising:

a probe base configured to operatively attach to a flexible dielectricbody of a contacting assembly that includes the conductive probe; and

a probe tip that extends from the probe base and is configured toproject from a surface of the flexible dielectric body and toelectrically contact the device under test, wherein the probe tipincludes:

-   -   an elongate apex configured to penetrate a contacted portion of        the device under test;    -   a wedge-shaped region that includes the elongate apex and        defines a wedge angle; and    -   an extension region that tapers from the probe base to the        wedge-shaped region and defines a taper angle.

E2. The conductive probe of paragraph E1, wherein the wedge-shapedregion includes a first wedge surface and a second wedge surface,wherein the wedge angle is defined by an angle of intersection between aplane that is parallel to the first wedge surface with a plane that isparallel to the second wedge surface.

E3. The conductive probe of any of paragraphs E1-E2, wherein alongitudinal axis of the elongate apex at least one of defines a line ofintersection between the first wedge surface and the second wedgesurface, is coextensive with the line of intersection between the firstwedge surface and the second wedge surface, and is parallel to the lineof intersection between the first wedge surface and the second wedgesurface.

E4. The conductive probe of any of paragraphs E1-E3, wherein the wedgeangle is less than 150 degrees, less than 140 degrees, less than 130degrees, less than 120 degrees, less than 110 degrees, less than 100degrees, or less than 90 degrees, and/or wherein the wedge angle isgreater than 70 degrees, greater than 80 degrees, greater than 90degrees, greater than 100 degrees, greater than 110 degrees, greaterthan 120 degrees, or greater than 130 degrees.

E5. The conductive probe of any of paragraphs E1-E4, wherein theextension region includes a first extension surface that extends betweenthe probe base and a/the first wedge surface and a second extensionsurface that extends between the probe base and a/the second wedgesurface, and further wherein the taper angle is defined by an angle ofintersection between at least one, and optionally both, of (1) the firstextension surface and the first wedge surface and (2) the secondextension surface and the second wedge surface.

E6. The conductive probe of any of paragraphs E1-E5, wherein the taperangle is at least one of (1) less than 180 degrees, less than 175degrees, less than 170 degrees, less than 165 degrees, less than 160degrees, less than 155 degrees, less than 150 degrees, less than 145degrees, less than 140 degrees, less than 135 degrees, less than 130degrees, less than 125 degrees, less than 120 degrees, less than 115degrees, less than 110 degrees, less than 105 degrees, or less than 100degrees, and (2) greater than 90 degrees, greater than 95 degrees,greater than 100 degrees, greater than 105 degrees, greater than 110degrees, greater than 115 degrees, greater than 120 degrees, greaterthan 125 degrees, greater than 130 degrees, greater than 135 degrees,greater than 140 degrees, or greater than 145 degrees.

E7. The conductive probe of any of paragraphs E5-E6, wherein a line ofintersection between at least one, and optionally both, of (1) the firstextension surface and the first wedge surface, and (2) the secondextension surface and the second wedge surface is at least substantiallyparallel, or parallel, to the surface of the flexible dielectric bodywhen the flexible dielectric body is in an undeformed configuration.

E8. The conductive probe of any of paragraphs E5-E6, wherein the firstextension surface is not parallel to the first wedge surface, andfurther wherein the second extension surface is not parallel to thesecond wedge surface.

E9. The conductive probe of any of paragraphs E1-E8, wherein theconductive probe is symmetrical in at least one, and optionally two,dimensions.

E10. The conductive probe of any of paragraphs E5-E9, wherein theextension region further includes a third extension surface that extendsbetween the probe base and the elongate apex, and a fourth extensionsurface that extends between the probe base and the elongate apex.

E11. The conductive probe of paragraph E10, wherein at least one, andoptionally both, of the third extension surface and the fourth extensionsurface is perpendicular to at least one, and optionally both, of thefirst extension surface and the second extension surface.

E12. The conductive probe of any of paragraphs E10-E11, wherein thetaper angle is a first taper angle, and further wherein a second taperangle is defined by an angle of intersection between at least one, andoptionally both, of (1) the third extension surface and the elongateapex and (2) the fourth extension surface and the elongate apex.

E13. The conductive probe of paragraph E12, wherein the second taperangle is at least one of (1) less than 180 degrees, less than 175degrees, less than 170 degrees, less than 165 degrees, less than 160degrees, less than 155 degrees, less than 150 degrees, less than 145degrees, less than 140 degrees, less than 135 degrees, less than 130degrees, less than 125 degrees, less than 120 degrees, less than 115degrees, less than 110 degrees, less than 105 degrees, or less than 100degrees, and (2) greater than 90 degrees, greater than 95 degrees,greater than 100 degrees, greater than 105 degrees, greater than 110degrees, greater than 115 degrees, greater than 120 degrees, greaterthan 125 degrees, greater than 130 degrees, greater than 135 degrees,greater than 140 degrees, or greater than 145 degrees.

E14. The conductive probe of any of paragraphs E10-E13, wherein theelongate apex extends between the third extension surface and the fourthextension surface.

E15. The conductive probe of any of paragraphs E1-E14, wherein a/thelongitudinal axis of the elongate apex is configured to be parallel tothe surface of the flexible dielectric body when the flexible dielectricbody is in an/the undeformed configuration.

E16. The conductive probe of any of paragraphs E1-E15, wherein a/thelongitudinal axis of the elongate apex is configured to be at a skewapex angle with respect to the surface of the flexible dielectric bodywhen the flexible dielectric body is in an/the undeformed configuration.

E17. The conductive probe of paragraph E16, wherein the skew apex angleis at least one of (1) less than 45 degrees, less than 40 degrees, lessthan 35 degrees, less than 30 degrees, less than 25 degrees, less than20 degrees, less than 15 degrees, less than 10 degrees, or less than 5degrees, and (2) greater than 1 degree, greater than 2 degrees, greaterthan 3 degrees, greater than 4 degrees, greater than 5 degrees, greaterthan 10 degrees, or greater than 15 degrees.

E18. The conductive probe of any of paragraphs E1-E17, wherein theelongate apex includes a longitudinal length of at least one of (1) atleast 25 micrometers (um), at least 30 um, at least 35 um, at least 40um, at least 45 um, at least 50 um, at least 55 um, at least 60 um, orat least 65 um, and (2) less than 105 um, less than 100 um, less than 95um, less than 90 um, less than 85 um, less than 80 um, less than 75 um,less than 70 um, or less than 65 um.

E19. The conductive probe of any of paragraphs E1-E18, wherein theconductive probe is configured to form the electrical connection with acontact surface that includes a characteristic dimension, wherein a/thelongitudinal length of the elongate apex is at least one of (1) lessthan 150%, less than 140%, less than 130%, less than 120%, less than110%, less than 100%, less than 90%, less than 80%, less than 70%, orless than 60% of the characteristic dimension of the contact surface,and (2) greater than 15%, greater than 20%, greater than 25%, greaterthan 30%, greater than 35%, greater than 40%, greater than 45%, greaterthan 50%, greater than 55%, or greater than 60% of the characteristicdimension of the contact surface, and optionally wherein thecharacteristic dimension includes at least one of a diameter, anequivalent diameter, and a maximum dimension of the contact surface.

E20. The conductive probe of any of paragraphs E1-E19, wherein the probebase includes a pair of spaced-apart, radially projecting ridges, andfurther wherein the ridges are configured to provide a surface area foran adhesive bond between the flexible dielectric body and the conductiveprobe.

F1. A contacting assembly for contacting a device under test, thecontacting assembly comprising:

a frame that defines an aperture;

a flexible dielectric body that is operatively attached to the frame, ismaintained in tension by the frame, and extends across the aperture;

a plurality of conductive probes that are operatively attached to theflexible dielectric body; and

means for maintaining an orientation of the plurality of conductiveprobes relative to respective test pads on the device under test at aplurality of different temperatures that includes at least a minimumtemperature and a maximum temperature, wherein the minimum temperatureand the maximum temperature define a threshold temperature range.

F2. The contacting assembly of paragraph F1, wherein the means formaintaining includes selecting a coefficient of thermal expansion of theframe to be within a threshold difference of a coefficient of thermalexpansion of the device under test.

F3. The contacting assembly of any of paragraphs F1-F2, wherein themeans for maintaining includes, or is, a means for preventing a loss ofcontact between the plurality of conductive probes and the respectivetest pads.

F4. A contacting assembly for contacting a device under test, thecontacting assembly comprising:

a frame that defines an aperture, wherein a coefficient of thermalexpansion of the frame is selected to be within a threshold differenceof a coefficient of thermal expansion of the device under test;

a flexible dielectric body that is operatively attached to the frame, ismaintained in tension by the frame, and extends across the aperture; and

a plurality of conductive probes that are operatively attached to theflexible dielectric body.

F5. The contacting assembly of any of paragraphs F1-F4, wherein an/theorientation of the plurality of conductive probes relative to respectivetest pads on the device under test is maintained at a/the plurality ofdifferent temperatures that include at least a/the minimum temperatureand a/the maximum temperature by at least one of thermal expansion andthermal contraction of the frame, wherein the minimum temperature andthe maximum temperature define a/the threshold temperature range.

F6. The contacting assembly of any of paragraphs F1-F5, wherein theframe is configured to maintain alignment of the plurality of conductiveprobes relative to a/the respective test pads on the device under testover a/the threshold temperature range by at least one of expanding andcontracting at a frame thermal expansion rate that is comparable to adevice under test thermal expansion rate.

F7. The contacting assembly of any of paragraphs F2-F6, wherein thethreshold difference is less than 25%, less than 20%, less than 15%,less than 10%, less than 5%, less than 4%, less than 3%, less than 2%,less than 1%, less than 0.5%, less than 0.1%, substantially zero, orzero, and optionally wherein the frame and the device under test areconstructed from the same material.

F8. The contacting assembly of any of paragraphs F1-F3 and F5-F7,wherein the threshold temperature range is at least 20 degrees C., atleast 30 degrees C., at least 40 degrees C., at least 50 degrees C., atleast 60 degrees C., at least 70 degrees C., at least 80 degrees C., atleast 90 degrees C., at least 100 degrees C., at least 110 degrees C.,at least 120 degrees C., at least 130 degrees C., at least 140 degreesC., at least 150 degrees C., at least 160 degrees C., at least 170degrees C., or at least 180 degrees C.

F9. The contacting assembly of any of paragraphs F1-F3 and F5-F8,wherein the minimum temperature is less than 0 degrees C., less than 10degrees C., less than 20 degrees C., less than 30 degrees C., less than40 degrees C., less than 50 degrees C., less than 60 degrees C., or lessthan 70 degrees C.

F10. The contacting assembly of any of paragraphs F1-F3 and F5-F9,wherein the maximum temperature is greater than 90 degrees C., greaterthan 100 degrees C., greater than 110 degrees C., greater than 120degrees C., greater than 130 degrees C., greater than 140 degrees C.,greater than 150 degrees C., greater than 160 degrees C., greater than170 degrees C., or greater than 180 degrees C.

F11. The contacting assembly of any of paragraphs F1-F10, wherein thecontacting assembly is configured to be mounted in a probe head of atest system, and further wherein the frame is configured to stretch theflexible dielectric body across a surface of a riser to maintain aplurality of conductive contacts between the plurality of conductiveprobes and the riser during operation of the test system.

F12. The contacting assembly of paragraph F11, wherein the contactingassembly is configured to be mounted within the probe head from a sideof the probe head that faces the device under test during testing of thedevice under test.

F13. The contacting assembly of paragraph F12, wherein the flexibledielectric body is configured to be tensioned across the riser.

F14. The contacting assembly of paragraph F13, wherein the riserseparates the flexible dielectric body from a space transformer, andfurther wherein an upper surface of the frame does not extend past anupper surface of the space transformer.

F15. The contacting assembly of any of paragraphs F1-F14, wherein a/thecoefficient of thermal expansion of the frame is greater than acoefficient of thermal expansion of the flexible dielectric body.

F16. The contacting assembly of any of paragraphs F1-F15, wherein thetension on the flexible dielectric body is sufficient to maintain theflexible dielectric body in tension by the frame throughout thethreshold temperature range.

G1. The probe head assembly of any of paragraphs A1-C61 or the testsystem of any of paragraphs D1-D3, wherein the plurality of conductiveprobes includes the conductive probe of any of paragraphs E1-E20.

G2. The probe head assembly of any of paragraphs A1-C61 or the testsystem of any of paragraphs D1-D3, wherein the contacting assemblyincludes the contacting assembly of any of paragraphs F1-F16.

G3. The contacting assembly of any of paragraphs F1-F16, wherein theplurality of conductive probes includes the conductive probe of any ofparagraphs E1-E20.

H1. A method of testing a device under test, the method comprising:

contacting the device under test with the probe head assembly of any ofparagraphs A1-C61;

providing an input signal to the device under test; and

receiving an output signal from the device under test.

H2. A method of testing a device under test, the method comprising:

providing an input signal to the device under test and receiving anoutput signal from the device under test using the test system of any ofparagraphs D1-D3.

H3. A method of maintaining an orientation of a plurality of conductiveprobes of a contacting assembly relative to respective test pads on adevice under test over a threshold temperature range, the methodcomprising:

testing the device under test at one temperature that is, and optionallya plurality of temperatures that are, within the threshold temperaturerange using the contacting assembly of any of paragraphs F1-F16.

H4. The method of paragraph H3, wherein the method further includesmounting the contacting assembly on a probe head.

H5. The method of paragraph H4, wherein the mounting includes mountingthe contacting assembly from a side of the probe head that is proximalto the device under test during testing of the device under test.

H6. The method of any of paragraphs H4-H5, wherein the mounting includestenting a flexible dielectric body of the contacting assembly across ariser of the probe head assembly.

I1. The use of any of the probe head assemblies of any of paragraphsA1-C61, any of the test systems of any of paragraphs D1-D3, any of theconductive probes of any of paragraphs E1-E20, or any of the contactingassemblies of any of paragraphs F1-F16 to test a device under test, andoptionally to at least one of functionally test, electrically test, andoptically test the device under test.

I2. The use of any of the probe head assemblies of any of paragraphsA1-C61, any of the test systems of any of paragraphs D1-D3, any of theconductive probes of any of paragraphs E1-E20, or any of the contactingassemblies of any of paragraphs F1-F16 to form at least one of anelectrical connection and an optical connection between a test systemand a device under test.

I3. The use of at least one of a riser, a rigid riser, and a resilientriser to provide a plurality of at least one of electrical and opticalconnections between a space transformer and a contacting assembly.

I4. The use of a resilient riser to increase compliance of a probe headassembly.

INDUSTRIAL APPLICABILITY

The systems, assemblies, and methods disclosed herein are applicable tothe device test industry.

It is believed that the disclosure set forth above encompasses multipledistinct inventions with independent utility. While each of theseinventions has been disclosed in its preferred form, the specificembodiments thereof as disclosed and illustrated herein are not to beconsidered in a limiting sense as numerous variations are possible. Thesubject matter of the inventions includes all novel and non-obviouscombinations and subcombinations of the various elements, features,functions and/or properties disclosed herein. Similarly, where theclaims recite “a” or “a first” element or the equivalent thereof, suchclaims should be understood to include incorporation of one or more suchelements, neither requiring nor excluding two or more such elements.

It is believed that the following claims particularly point out certaincombinations and subcombinations that are directed to one of thedisclosed inventions and are novel and non-obvious. Inventions embodiedin other combinations and subcombinations of features, functions,elements and/or properties may be claimed through amendment of thepresent claims or presentation of new claims in this or a relatedapplication. Such amended or new claims, whether they are directed to adifferent invention or directed to the same invention, whetherdifferent, broader, narrower, or equal in scope to the original claims,are also regarded as included within the subject matter of theinventions of the present disclosure.

1. A probe head assembly for testing a device under test, the probe headassembly comprising: a space transformer; a contacting assembly thatincludes a flexible dielectric body with a first body surface and anopposed second body surface, wherein the contacting assembly includes aplurality of conductive probes, and further wherein the plurality ofconductive probes is configured to form a plurality of test contactswith the device under test and to convey a plurality of test signalsbetween the first body surface and the opposed second body surface; anda riser configured to separate the space transformer from the contactingassembly and to convey the plurality of test signals between theplurality of conductive probes and the space transformer.
 2. The probehead assembly of claim 1, wherein the riser includes a composite riserassembly that includes at least a first riser and a second riser,wherein the first riser is configured to convey the plurality of testsignals between the plurality of conductive probes and the second riser,and further wherein the second riser is configured to convey theplurality of test signals between the first riser and the spacetransformer.
 3. The probe head assembly of claim 2, wherein the firstriser is a rigid riser, and further wherein the second riser is aresilient riser.
 4. The probe head assembly of claim 1, wherein theriser includes a first riser surface and a second riser surface, whereinthe first riser surface is proximal the space transformer relative tothe second riser surface, wherein the second riser surface is distal thespace transformer relative to the first riser surface, and furtherwherein the first riser surface is planarized.
 5. The probe headassembly of claim 4, wherein the space transformer includes a narrowpitch surface and a wide pitch surface, wherein the narrow pitch surfaceis proximal the riser relative to the wide pitch surface, and furtherwherein the first riser surface is not parallel to the narrow pitchsurface.
 6. The probe head assembly of claim 4, wherein the first risersurface is parallel to at least one of a device-under-test-proximal sideof a component of the probe head assembly other than the spacetransformer and a device-under-test-distal side of the component of theprobe head assembly.
 7. The probe head assembly of claim 1, wherein thespace transformer includes a narrow pitch surface, wherein the riserincludes a first riser surface and a second riser surface, wherein thefirst riser surface is proximal to the narrow pitch surface of the spacetransformer relative to the second riser surface, wherein the firstriser surface is at least substantially parallel to the narrow pitchsurface of the space transformer, wherein the second riser surface isdistal the narrow pitch surface of the space transformer relative to thefirst riser surface, and further wherein the second riser surface is notparallel to the narrow pitch surface of the space transformer.
 8. Theprobe head assembly of claim 1, wherein the plurality of conductiveprobes includes a plurality of rocking beam probes.
 9. The probe headassembly of claim 1, wherein the probe head assembly further includes aflexure configured to limit a contact force that is applied to thedevice under test by the probe head assembly.
 10. The probe headassembly of claim 9, wherein the flexure is located on a side of thespace transformer that is opposed to the contacting assembly.
 11. Theprobe head assembly of claim 9, wherein the probe head assembly furtherincludes a printed circuit board, and further wherein the flexure islocated between the printed circuit board and the space transformer. 12.The probe head assembly of claim 9, wherein the flexure includes atleast one of a resilient material, a resilient material with includedconductive flexure conduits, and a buckling beam.
 13. The probe headassembly of claim 1, wherein a thickness of the riser is at least 0.1 mmand less than 1.25 mm.
 14. The probe head assembly of claim 1, whereinthe riser is not a space transforming device.
 15. The probe headassembly of claim 1, wherein the riser includes a substantially rigidriser.
 16. The probe head assembly of claim 1, wherein the riserincludes a resilient riser.
 17. The probe head assembly of claim 1,wherein the riser is fabricated separately from the space transformerand operatively attached to the space transformer.
 18. The probe headassembly of claim 1, wherein the riser is in mechanical contact with thecontacting assembly, wherein the contacting assembly is tensioned acrossa surface of the riser to form a tensioned contacting assembly, andfurther wherein the tensioned contacting assembly generates a restoringforce that maintains the tensioned contacting assembly in contact withthe surface of the riser.
 19. The probe head assembly of claim 1,wherein the contacting assembly includes a membrane probe assembly,wherein the contacting assembly is operatively attached to a frameconfigured to retain the contacting assembly within the probe headassembly, wherein the contacting assembly includes the frame, whereinthe frame is configured to tension the flexible dielectric body across asurface of the riser to maintain the flexible dielectric body in astretched state when the frame is mounted in the probe head assembly,and further wherein the flexible dielectric body extends past thesurface of the riser and to the frame.
 20. The probe head assembly ofclaim 19, wherein the frame is configured to mount to the probe headassembly from a side of the probe head assembly that faces the deviceunder test during testing of the device under test.
 21. The probe headassembly of claim 1, wherein the probe head assembly is configured toconvey the plurality of test signals between the space transformer andthe plurality of conductive probes without transferring any of theplurality of test signals along a conductive trace that is present onthe flexible dielectric body of the contacting assembly.
 22. The probehead assembly of claim 1, wherein the probe head assembly includes anexternal test signal lead, wherein the external test signal lead isconfigured to provide an external test signal to a selected conductiveprobe of the contacting assembly without the external test signalpassing through at least one of the riser and the space transformer, andfurther wherein the external test signal lead includes at least one of(1) a conductive trace that is external to at least one of the riser andthe space transformer, and (2) a conductive trace that is present on theflexible dielectric body of the contacting assembly.
 23. A test systemfor testing a device under test, the test system comprising: the probehead assembly of claim 1; a chuck configured to position the deviceunder test with respect to the probe head assembly; a signal generatorconfigured to generate an input signal, wherein the input signal forms afirst portion of the plurality of test signals; and a signal analyzerconfigured to receive an output signal, wherein the output signal formsa second portion of the plurality of test signals.